DESIGN AND SIMULATION OF HEAT SINK FOR HIGH POWER ELECTRONICS USING CFD. International Journal of Scientific Research and Management (IJSRM), [S. l.], v. 1, n. 3, p. 145–149, 2013. Disponível em: https://ijsrm.net/index.php/ijsrm/article/view/21. Acesso em: 23 nov. 2024.