J. S , Tran., “DESIGN AND SIMULATION OF HEAT SINK FOR HIGH POWER ELECTRONICS USING CFD”, int.jour.sci.res.mana, vol. 1, no. 3, pp. 145–149, Jun. 2013, Accessed: Aug. 02, 2025. [Online]. Available: https://ijsrm.net/index.php/ijsrm/article/view/21